Deep-Tech
DYMAN proposes revolutionary technological advances focused on the use and management of clean and efficient cooling in data centres.
The previously unproven technology that will be developed in DYMAN will enable the advancement and positioning of European cooling.
Interoperability and Ontology-based based approach for Smart HPC systems
Innovations
- Low-temperature adsorbents that achieve high capacities at very low conduction temperatures below 50 °C.
- New adsorption heat exchangers made with 3D printed structures that integrate the adsorption material into a porous structure, reducing the internal thermal resistance.
- Two-phase cooling for high-performance computing servers to handle thermal loads more efficiently from next-generation processors.
- A new type of adsorption cooling system integration in the data centre environment.
- A new form of active data centre management integrating the cooling system as part of the optimisation of processor management by providing an ontology based on an AI-assisted approach to O&M practices.
